Laser glovebox welding
The Process
Glovebox laser welding is a precision technique that ensures an ultra-clean environment, critical for achieving high-quality welds in sensitive materials. To maintain optimal conditions, vacuum baking is employed to eliminate moisture and contaminants, ensuring that moisture and oxygen levels remain below 10 parts per million (ppm). This controlled atmosphere is vital for preventing oxidation and ensuring the reliability of the welds. Furthermore, the weld integrity can be rigorously tested in accordance with established military standards, including MIL-STD 883 Method 1014 for hermeticity testing, MIL-STD 202 Method 112 for moisture resistance, and MIL-STD 750 Method 1071.6 for thermal cycling, guaranteeing that the welded components meet stringent performance and reliability criteria in challenging environments.
Medical Devices
Microelectronics
Microelectronics
Laser welding of titanium implantable devices often necessitates the use of an argon glovebox environment to prevent oxidation, which can significantly compromise weld integrity. While the handling of materials in a glovebox can be more cumbersome compared to open-air welding, this method provides essential gas coverage to difficult-to-reach areas where conventional gas nozzles cannot be effectively utilized. By maintaining an inert atmosphere around the welding site, glovebox laser welding guarantees the highest standard of weld quality, which is critical for the reliability and performance of life-saving medical devices and assemblies. This meticulous approach ensures that the welds are not only strong but also biocompatible, meeting the stringent requirements inherent in the medical device industry.
Microelectronics
Microelectronics
Microelectronics
Laser hermetic sealing of microelectronic packages is a vital process that secures long-term reliability, even in the harshest environments. Commonly utilized materials for these packages include 6061 and 4047 aluminum, along with Kovar, which offer durability and stability necessary for demanding applications. The process typically begins with a vacuum bake to remove moisture and contaminants from the packages, followed by transfer into a controlled environment filled with dried nitrogen or argon. To enhance leak detection capabilities, a tracer gas of helium is introduced at levels of 10-20%, enabling fine leak checks with extraordinary sensitivity down to helium leak rates of 10^-10 cc /second. This meticulous approach ensures that the sealed packages remain impervious to environmental stresses, safeguarding the functionality and integrity of microelectronic components over time.